4,4'-Oxydiphthalic anhydride (ODPA) CAS 1823-59-2

Name: 4,4'-Oxydiphthalic anhydride (ODPA) CAS 1823-59-2
Brand: Aure Chemical
Price: 1.00 USD
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Synonyms: s-ODPA; 4,4'-Oxydiphthalic dianhydride; Bis-(3-phthalyl anhydride) ether; 4,4'-Oxybis(phthalic anhydride); 5,5'-Oxybis[1,3-isobenzofurandione]; 3,3',4,4'-Diphenyl ether tetracarboxylic acid dianhydride; 3,3',4,4'-Diphenyl oxide tetracarboxylic dianhydride; 1,3-Isobenzofurandione, 5,5'-oxybis-

Shandong Aure Chemical Co., Ltd. is one of the leading suppliers of ODPA in China and also one of the manufacturers of this product.

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Product Details

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4,4'-Oxydiphthalic anhydride (ODPA, CAS 1823-59-2) is an aromatic ether-linked dianhydride widely used as a monomer in the synthesis of high-performance polyimides, epoxy resins, and advanced polymer systems. The ether linkage within its molecular structure provides improved chain flexibility and processability while maintaining excellent thermal stability, chemical resistance, mechanical strength, and electrical insulation properties.

Basic Information of ODPA

Product Name	4,4'-Oxydiphthalic anhydride
Abbreviation	ODPA
CAS Number	1823-59-2
Molecular Formula	C16H6O7
Molecular Weight	310.21 g/mol
Appearance	White to light yellow to light orange powder or crystal
Purity	≥99.5%
Package	1kg/bottle, 20kg/drum, or customized
Molecular Structure

Key Properties

Ether-linked aromatic structure provides an optimal balance between thermal stability and molecular flexibility
Improved solubility and processability of polyimide precursors compared with fully rigid dianhydrides
Excellent chemical resistance and electrical insulation performance in cured polymer systems
Suitable for applications requiring mechanical durability, dimensional stability, and reliable performance at elevated temperatures

Key Applications of ODPA

Flexible Films, Coatings, and Adhesives (Primary Application): ODPA is widely used in flexible polyimide films, coatings, and high-performance adhesive systems, where enhanced chain flexibility, adhesion, and processing latitude are critical. ODPA-based polyimides are commonly applied in flexible films, coatings, and adhesive systems for electronics, industrial insulation, and advanced functional materials.

Electronics and Microelectronics (Secondary Application): Employed in electronic-grade polyimide films for flexible copper clad laminates (FCCL), flexible printed circuits, insulating layers, and nanohybrid dielectric films. ODPA-based polyimides are commonly applied in electronics and microelectronics due to their balanced dielectric properties and excellent processing characteristics.

Energy Storage and Electrochemical Devices: Applied in polyimide-based separators for supercapacitors and as functional binders or anode materials in lithium-ion batteries, benefiting from electrolyte compatibility and thermal endurance.

Composites and Structural Materials: Incorporated into high-performance composites, foams, molded parts, and films requiring durability, dimensional stability, and long-term heat resistance.

Adhesives and Epoxy Resin Systems: Used as a functional component in epoxy resins (including bisphenol A and novolac types), polyamide resins, and specialty adhesives for electrical insulation and structural bonding.

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Packaging, Logistics & Compliance Capabilities

Aure Chemical provides flexible packaging solutions, compliant logistics arrangements, and controlled storage practices to support laboratory-scale, pilot-scale, and commercial-scale global supply.