3,3',4,4'-Biphenyltetracarboxylic dianhydride (s-BPDA) CAS 2420-87-3

Name: 3,3',4,4'-Biphenyltetracarboxylic dianhydride (s-BPDA) CAS 2420-87-3
Brand: Aure Chemical
Price: 1.00 USD
Availability: InStock
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Synonyms: s-BPDA; 4,4'-Biphthalic dianhydride; 4,4'-Biphthalic Anhydride; Diphenyl-3,3',4,4'-tetracarboxylic Dianhydride; [5,5'-Biisobenzofuran]-1,1',3,3'-tetrone; 3,3',4,4'-Biphenyltetracarboxylic acid dianhydride

Shandong Aure Chemical Co., Ltd. is one of the leading suppliers of BPDA in China and also one of the manufacturers of this product.

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Product Details

BPDA / s-BPDA CAS 2420-87-3 for Polyimide Synthesis

3,3',4,4'-Biphenyltetracarboxylic dianhydride, commonly known as BPDA or s-BPDA, is a rigid aromatic dianhydride monomer used as a structural building block in high-performance polyimide synthesis. Its biphenyl dianhydride structure makes BPDA relevant to polyimide systems where thermal resistance, dimensional stability, low CTE and mechanical performance are important design considerations.

BPDA belongs to the broader category of polyimide dianhydride monomersand is also included in Aure Chemical’s Polyimide Monomers: Diamines and Dianhydrides technical guide. It is often considered in low-CTE polyimide films, high-temperature insulation, electronic-grade PI materials, flexible substrates and specialty polymer systems.

Basic Information of s-BPDA

Product Name	3,3',4,4'-Biphenyltetracarboxylic dianhydride
Abbreviation	BPDA / s-BPDA
CAS Number	2420-87-3
Product Type	Rigid aromatic dianhydride monomer
Molecular Formula	C16H6O6
Molecular Weight	294.22 g/mol
Appearance	White powder
Purity	≥ 99.9%
Melting Point	≥ 298°C
Metal Testing	Single metal ≤ 500 ppb; total metal ≤ 1 ppm;
Main Application	Low-CTE, high-temperature and electronic-grade polyimide synthesis
Package	1 kg/bottle, 20 kg/drum, or customized packaging
Documents	COA, SDS and TDS available upon request
Molecular Structure

Typical Specification of BPDA / s-BPDA

Item	Standard	Available Batch Result
Appearance	White powder	White powder
Purity (HPLC)	≥ 99.9%	99.91%
Melting Point	≥ 298°C	298.7°C
Single Metal	≤ 500 ppb	Approved
Total Metal	≤ 1 ppm	Approved
Storage Conditions	Sealed container; keep dry; store in a cool and dark place	Based on available COA reference

The above data is based on an available batch COA for BPDA / s-BPDA CAS 2420-87-3. Final specifications, batch data and documentation should be confirmed by the latest COA before order confirmation.

Key Features in Polyimide Design

Rigid biphenyl dianhydride structure, relevant to polyimide dianhydride monomers used in low-CTE and high-temperature PI systems.
Linear and rigid aromatic structure may support dimensional stability and low coefficient of thermal expansion depending on the paired diamine and processing method.
High-purity and low-metal-control requirements may be important for electronic-grade, flexible substrate and specialty polyimide material development.
BPDA-based PI systems are commonly discussed in electronics and microelectronics polyimide applications where dimensional stability, insulation and thermal endurance are important.
Final material properties depend on dianhydride purity, diamine selection, solvent system, imidization conditions, film orientation and polymer processing method.

Pairing BPDA with Diamine Monomers

In polyimide synthesis, BPDA may be evaluated with selected polyimide diamine monomers supply portfolio to design low-CTE, high-temperature and dimensionally stable PI systems. Rigid aromatic diamines may support thermal resistance and mechanical strength, while ether-containing diamines may help improve processability and film-forming behavior.

Fluorinated diamines such as TFMB / TFDB CAS 341-58-2 can be considered when the formulation requires additional control of dielectric behavior, optical performance or moisture uptake. Ether-containing diamines such as BAPP CAS 13080-86-9 may support processability and flexibility in selected PI systems.

Application Context of BPDA in Polyimide Systems

BPDA is typically used as a structural dianhydride monomer rather than a finished application material. It is commonly considered in low-CTE, high-temperature, electronic-grade and specialty polyimide material development, where dimensional stability, thermal resistance and mechanical performance are important design factors.

High-temperature aerospace polyimide insulation systems – heat-resistant insulation and structural polymer environments.
Electronics and microelectronics polyimide applications – low-CTE, insulation and thermally stable PI material design.
Low-CTE polyimide films and flexible substrates – BPDA-based systems may be considered where dimensional stability during thermal processing is important.
Specialty high-performance polymer systems – BPDA can be evaluated in research contexts where rigidity, heat resistance and mechanical integrity need to be balanced.

COA, SDS and Technical Documentation

Aure Chemical can provide COA, SDS, TDS, typical specifications and packaging information for BPDA / s-BPDA CAS 2420-87-3 upon request. Available batch COA shows 99.91% purity by HPLC, melting point of 298.7°C, approved single-metal testing under the listed standard, and approved total-metal testing under the listed standard.

Please share the required purity, metal ion control requirement, target specification, quantity, destination country or port, preferred packaging method and required documents so we can review availability, documentation support and export packing options.

Contact Aure Chemical for BPDA documentation and quotation support.

Packaging, Logistics & Compliance Capabilities

Aure Chemical provides flexible packaging solutions, compliant logistics arrangements, and controlled storage practices to support laboratory-scale, pilot-scale, and commercial-scale global supply.