1,3-Bis(3-aminophenoxy)benzene (APB) CAS 10526-07-5

Name: 1,3-Bis(3-aminophenoxy)benzene (APB) CAS 10526-07-5
Brand: Aure Chemical
Price: 1.00 USD
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Synonyms: Resorcinol Bis(3-aminophenyl) Ether; 3,3'-[1,3-phenylenebis(oxy)]bis(benzenamine); 3,3'-[m-Phenylenebis(oxy)]dianiline; 3,3'-Phenylenedioxydianiline; 1,3-Bis(m-aminophenoxy)benzene; 1,3,3-APB; 3-[3-(3-aminophenoxy)phenoxy]aniline

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Product Details

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1,3-Bis(3-aminophenoxy)benzene (APB), CAS 10526-07-5, is anaromatic diamine monomer for polyimide systemswith flexible ether linkages, used primarily in synthesizing high-performance polymers with enhanced thermal stability, mechanical strength, and processability.

Basic Information of APB

Product Name	1,3-Bis(3-aminophenoxy)benzene
Abbreviation	APB
CAS Number	10526-07-5
Molecular Formula	C18H16N2O2
Molecular Weight	292.33 g/mol
Appearance	White to light yellow to light orange powder to crystal
Purity	≥99%
Package	1kg/bottle, 20kg/drum, or customized
Molecular Structure

Key Properties

High-performance polyimide and copolyimide resins
Advanced engineering polymers and composite materials
Electronics insulating films and microelectronic materials withinpolyimide material systems used in electronics and semiconductor processing
Specialty polymers in aerospace, coatings, adhesives asfunctional polyimide formulations
Research & development monomer for novel polymer systems

Key Applications of APB

High-Performance Polymers: Serves as a monomer for polyimides, poly(ether ether ketone amide)s (PEEKAs), and copolymers, offering high glass transition temperatures (190–220°C) and thermal decomposition above 500°C, supportingpolyimide materials evaluated for high-temperature environments.

Electronics and Electrical Insulation: Incorporated into polyimides for flexible copper clad laminates (FCCL) and semiconductor-related sheets, withinpolyimide material systems studied for electronics and semiconductor processing environments.

Aerospace and Automotive: Utilized as a structural contributor in high heat-resistant plastics and adhesive systems, aligning withhigh-temperature polyimide material research contexts.

Coatings and Adhesives: Acts as a curing agent in epoxy resins and polyurethane coatings, contributing to toughness and flexibility inspecialty functional polymer formulations.

Advanced Materials: Explored in composite materials and experimental polymer systems, including studies related toflexible and processable polyimide system development.

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